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chip for sanitary napkin absorbency core
High quality function chip for sanitary napkin absorbency core raw materials

Anion and anti-bacterial composite chips applied in sanitary napkin can release negative ions.

Super Soft Nonwoven for baby diaper
SSS Super Soft Nonwoven for adult diaper

Hydrophilic spunbonded nonwoven fabric in hygiene industry mainly used as topsheet for various disposable baby diaper,adult diaper, sanitary napkins, underpads, breast pads, wet wipes etc.

fluff pulp SAP absorbent paper
Raw materials fluff pulp SAP absorbent paper for sanitary napkin absorbency core

1.Fluff pulp are used in diapers, feminine hygiene products 2.Untreated, bleached without chlorine, Excellent fiberization

Super Absorbent Polymer for nappy
white SAP super absorbent for baby diaper

SAP for sanitary napkin has fast suction of blood, high absorption capacity, good gel strength and moisture resistance. According advanced production technology, SAP is non-toxic, no smell and no stimulation to skin.

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  • Common Problem Analysis of Hot Melt Adhesive
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    Hot melt adhesive is a plastic adhesive, its physical state changes with temperature in a certain range. And it is a non-toxic and tasteless environmentally friendly chemical. Adhesive non-s...

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Common Problem Analysis of Hot Melt Adhesive

2018-02-26

Hot melt adhesive is a plastic adhesive, its physical state changes with temperature in a certain range. And it is a non-toxic and tasteless environmentally friendly chemical.

Adhesive non-stick
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Hot melt adhesive is not sticky for many reasons, and temperature is one of the most common factors that affect its performance.

As the weather turns cold, when the material is bonding, the adhesive already start setting. Even not setting, the best bonding time was missed. In some northern regions, the raw material temperature is too low to get good bonding effect.

Hot melt adhesive film has certain requirement for operating temperature, so it is necessary to adjust the temperature according to the product parameters.

How to improve bonding effect? The material can be preheated through drying tunnel or infrared ray to improve the bonding effect.

Wiredrawing problem
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1. Hot melt adhesive setting time.
Hot melt adhesive setting time is a key factor that caused wiredrawing problem. Generally speaking, the shorter hot-melt adhesive setting time, the lower probability of wiredrawing problem happened. The filaments are formed when hot melt adhesive spraying out of the muzzle, due to rapid setting, it cannot continue to stretch but prone to fracture, sometimes even cannot see the filament.

2.The influence of machine temperature.
Hot melt adhesive consistency increased due to low machine temperature, thus caused wiredrawing problem.

High temperature caused bubbles
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Normally, hot melt adhesive is melted by heating in glue machine. After melted, the adhesive becomes liquid, and operated by coating, spraying, and striping.

In the process of melting, sometimes bubbles will appear. So what is the reason for bubbling? In general, the solid adhesive itself has bubbles, bubbles will appear after melted, or the solid adhesive contains water, which is easy to bubble when heating. Also, solid adhesive is destroyed by high temperature and produce gas, thus caused bubbles.

Therefore, the operating temperature should be controlled during the use of hot melt adhesive; the equipment should be cleaned regularly to prevent carbon deposition; local temperature should be avoid too high and caused damage to the solid adhesive and affect its performance.

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